Insert Molding
Smart Cables, Dongles, Embedded ElectronicsInsert Molding - Our Experience
 We have has over 50 years of experience with insert molding and insert molded cable assemblies. We process a wide range of thermoplastic
materials and have a large selection of mold tooling. Over 2,500 over mold tool designs for over 100 types of connectors are available to our customers. With over 800 overmolds in stock, our modular mold system ensures unparalleled cost reductions to your project.
Our technical staff is ready to help in the design, prototyping and manufacturing your product to your exact specifications. We can terminate
industry standard connectors to cable or work with you to develop a new connector interface. We are also available and fully equipped to provide
complete, in depth insert molding training and technology transfer to your company. Insert Molding - Introduction
Insert molding is a fast growing segment of the cable assembly industry. As products become more mobile and compact, insert molding of PCBs within the cable assembly becomes a desirable and cost-effective
alternative to on-board electronics. These devices are typically referred to as smart cables or dongles The demand for robust and portable interconnect devices spearheaded new design approaches. Many of
these devices evolved into over-molded products. Today the cable assembly industry, in general, has matured significantly. However, few manufacturers have gained our depth of experience in insert molding
even small, very high-density connectors and utilizing high precision control systems in the injection
molding process. So, while insert molding is not a candidate for all applications, the right mix of insert molding experience, and product design makes for an unbeatable combination. Insert Molding Advantages
 Over molding of a PCBA device is a practical approach when the size of the PCBA is
no larger than 4 X 4 X 1" and it has a cable attached.Some of the key benefits are:
There are two types of bonding that occur in insert molding, molecular and mechanical. Molecular bonding
can occur when the insert material is the same as or similar to the encapsulating resin. This yields the best
results both in terms of physical strength and leak resistance. . Mechanical bonding can occur in two ways,
by the shrinking of the encapsulating resin around the insert as the resin cools, or by the surrounding of irregularities in the surface of the insert by the encapsulating resin. Design Considerations.
In general, the basic design rules for insert molding are the same as those that apply to injection-molding.
However, designers should also be aware of the following elements that may affect the design of their parts:
These elements determine what encapsulating resins will work for the application. They also establish the
type of material preparation that must be performed on the insert in order to ensure proper performance of the finished part. For Insert Molding Cable Manufacturing at its Best
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Reduced cost